Feature 1Accurate Alignment Measurement Value: This motherboard layering test frame adopts double ended probes to accurately align the small holes to enhance the contact performance, and the fixed clips buckle pressure, the motherboard does not buckle, the test data is more accurate. 2Multi Function Testing: This motherboard layered test frame can test power on, display, baseband, WIFI, touch, camera, photosensitive and other functions. 3Easy Operation: This motherboard layered test rack is easy to operate, without the need to place shims, you only need to sequentially RF motherboards, pin boards, logic motherboards, laminated stacked on the base of the test rack. 4Copper Spring Probe: This motherboard delamination test stand adopts copper spring probe, good conductivity, stable product overload, small deviation of detection value is more accurate. 5Wide Application: This motherboard layered test frame has a wide range of applications and is suitable for use with multiple models of cell phone motherboards, such as for iPhone 13, 13Mini, 13PRO MAX, 13PRO.Item Type: Motherboard Layered Test FrameModel: C21Process: CNC, EtchingFunction: Motherboard Lamination Free InspectionModel: for iPhone13, 13Mini, 13PRO MAX, 13PROFeatures: No Welding Test Plone Functions, Power On, Display, Baseband, WIFI, Touch, Camera, Sensor, etc. .wang-edit-text{ font-family:'Arial' !important; } .wang-edit-text table { border-top: 1px solid #000; border-left: 1px solid #000; } .wang-edit-text table td, .wang-edit-text table th { border-bottom: 1px solid #000; border-right: 1px solid #000; padding: 3px 5px; } .wang-edit-text table th { text-align: center; }Package List1 x Motherboard Layered Test Frame