PTM7950 Thermally Conductive Phase Change Material — pad and paste formats Overview PTM7950 is a thermally conductive phase change material supplied in both pad and paste formats. It is formulated from a novel polymer PCM system to reduce thermal resistance at interfaces, provide consistent wetting across normal operating temperatures, and maintain low surface contact resistance over extended reliability testing. Key benefits Reduced interface thermal resistance: wetting behavior produces very low surface contact resistance for improved heat transfer between components and heatsinks. Proven longterm reliability: material passes 150C baking for 1000 hours and thermal cycle with bias for 1000 cycles, maintaining low thermal impedance after testing. Flexible application options: available as preformed pads for repeatable placement and as a paste for dispensing or manual filling, enabling scalable manufacturing. Consistent thermal performance: polymerbased PCM preserves thermal contact as assemblies cycle through operating temperatures. Costeffective scalability: designed for use in production environments with formats and properties that support automated or manual assembly. Important attributes Function: thermal interface material that fills microscopic surface irregularities and reduces interface resistance through phase change and conformal wetting. Material: novel polymer phase change material engineered for interface wetting and stability in normal operating temperature ranges. Formats: both pad and paste variants to suit different assembly methods and design constraints. Performance: extremely low surface contact resistance in service; maintains low thermal impedance after extended baking and thermal cycling tests. Compatibility: suitable for electronic power modules, LED arrays, power conversion hardware, and other systems where efficient thermal coupling between components and heat spreaders or heatsinks is required. Reliability data: passes 150C baking for 1000 hours and thermal cycle with bias for 1000 cycles. Practical application scenarios Power electronics module: apply PTM7950 pad between a power MOSFET or IGBT package and a heatsink to improve heat flow and reduce junction temperature under sustained load. LED lighting arrays: use paste form to fill gaps between LED carriers and a metal core printed circuit board or heat spreader, ensuring uniform thermal contact across multiple LEDs. Telecom and datacenter power supplies: employ PTM7950 in paste form to thermally couple DCDC converters and voltage regulators to chassismounted heat dissipation structures for reliable longterm operation. Handling and implementation notes Choose pad format for consistent, repeatable placement and simplified assembly. Choose paste format for gap filling, dispensing, or applications. Evaluate pad thickness and paste volume to match interface gap and mechanical tolerance for phase change contact. Design for intended operating temperature range so the PCM can wet surfaces and provide low contact resistance during normal use. PTM7950 offers a reliable, polymerbased phase change approach to lowering thermal interface resistance in demanding electronic applications while supporting multiple application methods for production scalability.