The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
- Brand: Unbranded
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
- Brand: Unbranded
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14-Day Returns Policy
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Description
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
- Brand: Unbranded
- Category: Education
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Artist: Gerard Kelly
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Format: Paperback
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Language: English
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Publication Date: 2012/10/08
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Publisher / Label: Springer
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Number of Pages: 134
- Fruugo ID: 343653018-752834017
- ISBN: 9781461372769
Delivery & Returns
Dispatched within 5 days
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STANDARD: €4.99 - Delivery between Tue 30 December 2025–Thu 01 January 2026
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